Visit Accelicon at TSMC OIP booth #212
Cupertino, CA – October 14, 2011 – Accelicon Technologies, Inc. (Accelicon), the technology leader in device-level modeling and validation, and PDK solutions, will present at the TSMC OIP (Open Innovation Platform) Ecosystem Forum, which is to be held October 18 at San Jose Convention Center, CA.
The TSMC OIP Ecosystem Forum is a first-of-its-kind event organized by TSMC. With this forum, TSMC offers partners an effective marketing venue to reach about 1,000 of director-level and above executives from our customers. This forum will feature a day-long, three-track technical conference along with an Ecosystem Pavilion featuring up to 80 partner companies.
Accelicon will exhibit its industry-leading device modeling and validation solutions at booth #212. Please contact Tim K Smith to schedule a meeting and/or demonstration in advance.
About Accelicon
Accelicon Technologies, Inc. (Accelicon) based in
Contact
Accelicon Technologies, Inc.
info@accelicon.com